10.14489/td.2024.07.pp.054-067

2024, 07 July

DOI: 10.14489/td.2024.07.pp.054-067

Artemyev B. V., Isroilov Zh. O., Samuhair Mulatola, Selivanov K. V.
EQUIPMENT FOR X-RAY INSPECTION OF PRINTED CIRCUIT BOARDS, INCLUDING BGA
(pp. 54-67)

Abstract. In the modern world, there is mass production of electronic equipment, microelectronics and electronic components. To reduce the number of defects and refine production processes, it is imperative to control the quality of manufactured products at all stages of production. Of all the non-destructive methods of installation quality control, the most effective is radiation non-destructive testing, namely X-ray tomography. This article provides an overview of equipment designed for X-ray tomography and laminography used in quality control of soldering and installation of electronic equipment. The equipment under consideration makes it possible to identify defects that arise when the technological process of electronic equipment production is disrupted, including poor-quality soldering when installing microcircuits in BGA packages.

Keywords: non-destructive testing, laminograph, tomograph, X-ray, BGA, printed circuit board.

+ - About the Authors Click to collapse

B. V. Artemyev, Zh. О. Isroilov, Samuhair Mulatola, K. V. Selivanov (Bauman Moscow State Technical University (National Research University), Moscow, Russia) E-mail: Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра. , Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра. , Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра. , Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра.

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