10.14489/td.2014.08.pp.057-066

2014, 08 August

DOI: 10.14489/td.2014.08.pp.057-066

Gridnev V.N., Sergeeva M.D., Chebova A.I.
LINEAR MODELS FOR DETECTION OF FAULTS IN THE ELECTRONIC CELLS WITH USING THERMAL IMAGING METHOD
(pp. 57-66)

Abstract. Contactless thermal control, which is the subject of analysis in this paper is a type of non-destructive testing. Non-destructive testing is a kind of materials and products control that has no damaging effect on the control subject. Contactless thermal control, or infrared ther-mography, or thermal imaging is a technique for remote registration, visualization and analysis of thermal (temperature) fields of objects based on their IR (infrared) radiation. Active thermal control is a kind of thermal control in which there is an additional heat stimulation of the object. The paper focuses on the recognition thermograms models. Existing algorithms for vector quantization are briefly analyzed. In con-clusion recommendations for the thermal control of electronic non-contact cells are given.

Keywords: infrared thermography, non-contact thermal control of electronic equipment, thermal imaging.

+ - About the Authors Click to collapse

V. N. Gridnev, M. D. Sergeeva, A. I. Chebova
BMSTU, Moscow, Russia. E-mail: Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра.

+ - References Click to collapse

1. Panfilova S. P., Vlasov A. I., Gridnev V. N., Chervinskii A. S. (2007). Contactless thermal testing of electronic devices. Proizvodstvo elektroniki: tekhnologii, oborudovanie, materialy, (3), pp. 25-30.
2. Fishbune R. J. (2000). Infrared Thermography for Electronic Assembly Design Verification. IBM Power Technology and Qualification.
3. Pacheco M., Wang Z., Skoglund L. et al. (2005). Ad-vanced fault isolation and failure analysis techniques for future package technologies. Intel Technology Journal, 9(4), pp. 337-352. doi: 10.1535/itj.0904.07
4. Guliaev Iu. V., Galushkin A. I. (Eds.), Bukhalto A. N., Buryi E. V., Vlasov A. I. et al. (2003). Neurocomputers in image processing systems.Book 7. Moscow: Radiotekhnika.
5. Kliuev (2006). Non-destructive testing. Handbook. In 8 volumes. Vol. 5. Book 1. Thermal testing. (2nd (Revised and Supplemented) ed.). Moscow: Mashinostroenie.
6. Panfilova S. P., Vlasov A. I., Gridnev V. N., Chervinskii A. S. (2007). Contactless thermal testing of elec-tronic-computing facilities. Tekhnologiia i konstruirovanie v elektronnoi apparature, (6), pp. 1-9.
7. Vlasov A. I., Gridnev V. N., Konstantinov P., Iudin A. V. (2004). Neural network methods of defectoscopy of the circuit boards. Elektronnye komponenty, (9), pp. 148-155.
8. Buianov A. I., Vlasov A. I., Zagoskin A. (2002). Application of neural network methods for testing of printed circuit boards. Neirokomp'iutery i ikh primenenie, (5), pp. 42-70.
9. Buianov A. A., Vlasov A. I., Gridnev V. N. (2002). Neirosetevoi apparatno-programmnyi kompleks defektoskopii pechatnykh plat po mikroshlifam. (Neural network hardware and software complex of defectoscopy of printed circuit boards for microsections). 3-ia Mezhdunarodnaia konferentsiia «Komp'iuternye metody i obratnye zadachi v nerazrushaiushchem kontrole i diagnostike». (Proceedings of the 3rd International confer-ence «Computer methods and inverse problems in nondestructive testing and diagnostics»). Moscow. 18 – 21 March 2002.
10. Mandel' I. D. (1988). Cluster analysis. Moscow: Finansy i statistika.
11. Ramamurthi B., Gersho A. (1986). Classified Vector Quantization of Images. IEEE trans. on Communlcatlofls, pp. 1105 – 1115.

+ - Purchase digital version of a single article Click to collapse

This article is available in electronic format (PDF).

The cost of a single article is 250 rubles. (including VAT 18%). After you place an order within a few days, you will receive following documents to your specified e-mail: account on payment and receipt to pay in the bank.

After depositing your payment on our bank account we send you file of the article by e-mail.

To order articles please fill out the form below: