10.14489/td.2015.04.pp.056-060

2015, 04 April

DOI: 10.14489/td.2015.04.pp.056-060

Bulaev I.Yu.
ERY-LOW-VOLTAGE TESTING FOR REJECTION OF WEAK INTEGRATED CIRCUITS
(pp. 56-60)

Abstract. Internal defects of modern chips is sometimes impossible to detect with conventional functional or parametric testing. In cases where defects are too small, they have no significant effect on the chip operation and will not cause the malfunction. However, after some time of use as a result of the flow of materials degradation processes product defect may increase and cause per-manent damage of the chip. Therefore, it is important to detect such internal defects. The report deals with the various methods of diagnostic non-destructive testing, gives its advantages and disadvantages. It is specially noted the method of the critical voltage to find hidden defects in modern chips.

Keywords: electronic component base, non-destructive diagnostic testing, very low voltage testing.

+ - About the Authors Click to collapse

I. Yu. Bulaev
JSC “Russian Space Systems”, Moscow, Russia. E-mail: Данный адрес e-mail защищен от спам-ботов, Вам необходимо включить Javascript для его просмотра.

+ - References Click to collapse

1. Piet Engelke, Ilia Polian, Michel Renovell et al. (1996). The Pros and Cons of very-low-voltage testing: an analysis based on resistive bridging faults. In VLSI Test Symp, pp. 338 – 343.
2. Pokrovskii F. N., Nomokonova N. N. (1996). CMOS integrated circuits: forming and quality assessment. Vladivostok: Izdatel'stvo Dal'nevostochnogo universiteta.

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